Plasma Process Group

Plasma Process Group

Ion beam source technology for etching and deposition throughout R&D and industry

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About

Plasma Process Group is a leading provider of ion beam technology for coating applications, including ion-beam assisted deposition (IBAD), ion beam sputtering (IBS) and etching. Established in 2003, the company offers a comprehensive range of products, including ion beam sources, power supplies and grid assemblies, all designed to meet the demanding needs of research and production environments.

Key features

  • Leading ion beam technology
  • Comprehensive product range
  • Wide-ranging deposition and etching applications
  • Ideal for optical coatings
  • Exceptional product and applications support
  • Coatings service available

Applications

  • Ion-beam assisted deposition (IBAD): Providing ion bombardment on growing films, for superior properties.
  • Ion-beam sputtering (IBS): A generated ion beam ejects material from a target, which then condenses to form a film on a substrate
  • Etching: Removal of material using a focussed ion beam, for fabrication or pre-process cleaning purposes.


Plasma Process Group technology provides for all these techniques, particularly as applied to semiconductor and optical coatings uses.

Technologies

Ion beam sources
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Ion beam sources

The key parts of an ion beam source package are the ionisation chamber, grids, neutraliser and power supply and control unit. The ionisation chamber creates the plasma by ionising a gas using an electrical bias (DC or RF). With plasma formed, ions are accelerated through electrostatic fields created by the grids, forming a beam directed to the target substrate. The neutraliser ejects electrons to minimise the destabilising effects of charging. User operation is through a power supply and control unit.

Plasma Process Group provides a knowledge base covering all aspects of ion beam source technology and IBAD, IBS and etching applications.


Grid assemblies (ion optics)
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Grid assemblies (ion optics)

Different grids are available, varying in geometry and material. Convergent grids focus the ion beam on a target while divergent grids spread the beam over a larger area. Grid materials include molybdenum, titanium and graphite — each offers specific advantages. Molybdenum provides high melting point and strength and offers easy maintenance, while graphite gives thermal stability and low sputtering yield. Titanium is used as an alternative to molybdenum in some cases.

Products

Ion beam sources
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Ion beam sources

A variety of sizes and options for RF or DC plasma generation allow configuration of ion beam sources for specific IBS, IBAD or etching requirements, for both research and industry. As well as circular sources, wide area linear-type assemblies are also available — ideal for in-line roll-to-roll or web coating applications.

Grid assemblies
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Grid assemblies

Plasma Process Group manufacture molybdenum, graphite and titanium grid assemblies. Divergent, convergent or flat designs are available, to suit different applications and setup geometries.

Custom designs can also be provided.

Power supply and control units
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Power supply and control units

The I-BEAM series provides a variety of power supply and control unit configurations for operation of Plasma Process Group and legacy ion beam sources.

Techne — ion-beam sputtering system
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Techne — ion-beam sputtering system

The Techne platform offers a complete and versatile solution for deposition processes, featuring both planetary and single-axis substrate motion. It accommodates substrates up to 8”/200 mm on a planetary fixture and up to 12”/300 mm on a single-axis fixture. The deposition geometry is optimised for coating rate and uniformity, and minimal contamination, achieving nominal rates of 1 – 4 Å/s with <0.5% optical uniformity over an 8” planet diameter. The system includes automated control with a real-time data logger, and process control via Time/Power, QCM and end-user triggers. Maintenance is simplified with front and rear doors and the small chamber volume allows for pump-down times of approximately 30 minutes. The tool supports two or three target operations, with the two-target option providing rotating targets to extend target life and reduce deposition rate drift. Designed for both primary and assisted deposition, the Techne system ensures high performance and reliability.

This provides an overview of the Plasma Process Group range. For more details, please contact us or visit the Plasma Process Group website.

Contact us today to find out more